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Re: [Amps] Re: Using Surface-Mount Devices

To: Dave Haupt <emailw8nf@yahoo.com>
Subject: Re: [Amps] Re: Using Surface-Mount Devices
From: peter.chadwick@zarlink.com
Date: Tue, 16 Sep 2003 17:26:28 +0200
List-post: <mailto:amps@contesting.com>
Dave said

>We've done a few solder-bumped WSPs, with 20mil
>(0.5mm) center-to-center spacing on the pads.  There
>are rumours that industry is going to head towards
>0.4mm and even 0.35mm, but they will reach a limit.

We're using 10 mil (.25mm) spacing on a 40 'pin' WSP package. Not my
choice, but there.....

I'm beginning to think that moving to octal tube sockets was pushing it a
bit far!

73

Peter G3RZP


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