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References: [ +subject:/^(?:^\s*(re|sv|fwd|fw)[\[\]\d]*[:>-]+\s*)*\[Amps\]\s+Tetrode\s+Boards\s+Grounding\s+Scheme\s*$/: 3 ]

Total 3 documents matching your query.

1. [Amps] Tetrode Boards Grounding Scheme (score: 1)
Author: "Dugas, Jason A. (JSC-EP)" <Jason.A.Dugas@nasa.gov>
Date: Tue, 6 Jan 2009 12:28:10 -0600
I am constructing an amplifier and am using the Tetrode boards to run the power supplies. I had a question concerning the grounding scheme: The ground potential for each of the boards is tied to the
/archives//html/Amps/2009-01/msg00035.html (8,234 bytes)

2. Re: [Amps] Tetrode Boards Grounding Scheme (score: 1)
Author: Ian White GM3SEK <gm3sek@ifwtech.co.uk>
Date: Wed, 7 Jan 2009 16:45:54 +0000
It helps to keep the leads between the two control boards reasonably short. If you use rather heavier wire for the CATHODE/CHASSIS bonding, this helps to prevent nuisance tripping of the protection c
/archives//html/Amps/2009-01/msg00038.html (9,672 bytes)

3. Re: [Amps] Tetrode Boards Grounding Scheme (score: 1)
Author: "Jim Brown" <jim@audiosystemsgroup.com>
Date: Thu, 08 Jan 2009 11:12:08 -0800
In most interconnect wiring, the concern is NOT IR drop (or IZ drop) for the signal, but rather for NOISE current induced onto signal wiring. In general, the signal is a voltage from a low Z source w
/archives//html/Amps/2009-01/msg00066.html (8,945 bytes)


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